| 16Mb SDRAM |
| Part No. |
Organization |
|
Speed Grade |
|
|
Voltage |
Package |
Status* |
RoHS |
| W9816G6IB |
1Mx16 |
2 Banks |
-6 |
166 MHz |
CL3 |
3.3V±0.3V |
Packaged in VFBGA 60 balls pitch=0.65mm, using Lead free materials with RoHS compliant |
P |
Y |
| -7 |
143 MHz |
2.7V~3.6V |
| W9816G6IH |
1Mx16 |
2 Banks |
-5 |
143 MHz |
CL2 |
3.3V±0.3V |
Package in 50-pin, 400 mil TSOP II, using Lead free materials with RoHS compliant |
P |
Y |
| 200 MHz |
CL3 |
| -6/-6I/-6A |
166 MHz |
3.3V±0.3V |
| -7/-7I |
143 MHz |
2.7V~3.6V |
| * Status: P= Mass Production, S=Samples, UD=Under Development, UD (Time)= Under Development(Ready Time), EOL=End of life. |
| 64Mb SDRAM |
| Part No. |
Organization |
|
Speed Grade |
|
|
Voltage |
Package |
Status* |
RoHS |
| W9864G2GH |
2Mx32 |
4 Banks |
-5 |
200 MHz |
CL3 |
3.3V±0.3V |
Packaged in TSOP II 86-pin (400 mil) using Pb free with RoHS compliant |
N |
Y |
| -6/-6I |
166 MHz |
| -7 |
143 MHz |
2.7V~3.6V |
| W9864G2IB |
2Mx32 |
4 Banks |
-6 |
166 MHz |
CL3 |
3.3V±0.3V |
Packaged in TFBGA 90 ball(8x13mm2 ), using Lead free materials with RoHS compliant |
P |
Y |
| -7 |
143 MHz |
2.7V~3.6V |
| W9864G2IH |
2Mx32 |
4 Banks |
-5 |
200 MHz |
CL3 |
3.3V±0.3V |
Packaged in TSOP II 86-pin, using Lead free materials with RoHS compliant |
P |
Y |
| -6/-6I/-6A |
166 MHz |
| -7 |
143 MHz |
2.7V~3.6V |
| W9864G6IH |
4Mx16 |
4 Banks |
-5 |
200 MHz |
CL3 |
3.3V±0.3V |
Packaged in TSOP II 54-pin, 400 mil using Lead free materials with RoHS compliant |
P |
Y |
| -6/-6I/-6A |
166 MHz |
| -7/-7S |
143 MHz |
2.7V~3.6V |
| W9864G6JH |
4Mx16 |
4 Banks |
-5 |
200 MHz |
CL3 |
3.3V±0.3V |
Packaged in TSOP II 54-pin, 400 mil using Lead free materials with RoHS compliant |
P |
Y |
| -6/-6I |
166 MHz |
| -7/-7S |
143 MHz |
2.7V~3.6V |
| * Status: P= Mass Production, S=Samples, UD=Under Development, UD (Time)= Under Development(Ready Time), EOL=End of life, N= None for new design. |
| 128Mb SDRAM |
| Part No. |
Organization |
|
Speed Grade |
|
|
Voltage |
Package |
Status* |
RoHS |
| W9812G2IH |
4Mx32 |
4 Banks |
-6C |
166 MHz |
CL3 |
3.3V±0.3V |
Packaged in TSOP II 86-pin, using Lead free materials with RoHS compliant |
P |
Y |
| -6/-6I/-6A |
2.7V~3.6V |
| -75 |
133 MHz |
| W9812G2IB |
4Mx32 |
4 Banks |
-6/-6I/-6A |
166 MHz |
CL3 |
2.7V~3.6V |
Packaged in TFBGA 90 Ball(8x13mm2 ), using Lead free materials with RoHS compliant |
P |
Y |
| -75 |
133 MHz |
| W9812G6IH |
8Mx16 |
4 Banks |
-5 |
200 MHz |
CL3 |
3.3V±0.3V |
TSOP II 54-pin, 400 mil using Lead free materials with RoHS compliant |
P |
Y |
| -6/-6C/-6I/-6A |
166 MHz |
| -75 |
133 MHz |
| W9812G6JH |
8Mx16 |
4 Banks |
-5 |
200 MHz |
CL3 |
3.3V±0.3V |
TSOP II 54-pin, 400 mil using Lead free with RoHS compliant |
P |
Y |
| -6/-6I |
166 MHz |
| -75 |
133 MHz |
| * Status: P= Mass Production, S=Samples, UD=Under Development, UD (Time)= Under Development(Ready Time), EOL=End of life. |
| 256Mb SDRAM |
| Part No. |
Organization |
|
Speed Grade |
|
|
Voltage |
Package |
Status* |
RoHS |
| W9825G2DB |
8Mx32 |
4 Banks |
-6 |
166 MHz |
CL3 |
3.3V±0.3V |
TFBGA 90 ball using Pb free with RoHS compliant |
P |
Y |
| -6I |
2.7V~3.6V |
| -75/75I |
133 MHz |
| W9825G6EH |
16Mx16 |
4 Banks |
-5 |
200MHz |
CL3 |
3.3V±0.3V |
Packaged in TSOP II 54-pin, 400 mil - 0.80, using Lead free materials with RoHS compliant |
P |
Y |
| -6/-6I/-6A |
166 MHz |
| -6 |
133 MHz |
CL2 |
| -75/75I/75A |
CL3 |
| W9825G6JH |
16Mx16 |
4 Banks |
-5 |
200MHz |
CL3 |
3.3V±0.3V |
Packaged in TSOP II 54-pin, 400 mil - 0.80, using Lead free materials with RoHS compliant |
P |
Y |
| -6/-6I |
166 MHz |
| -6 |
133 MHz |
CL2 |
| -75 |
CL3 |
| * Status: P= Mass Production, S=Samples, UD=Under Development, UD (Time)= Under Development(Ready Time), EOL=End of life. |
